Autodesk Heads to CES

Every year the Consumer Electronics Show (CES) attracts the biggest names in consumer technology to reveal their newest hardware and software products.

Autodesk is excited to be a part of this year’s show with some consumer news of its own including a new partnership with Intel and the acquisition of technology, which will now officially be part of the 123D Circuits family.

During his keynote, Intel’s CEO Brian Krzanich announced a new chip, Intel Edison, a new Quark technology-based computer housed on an SD card form factor with built-in wireless, whose design will be available in the 123D Circuits library. The addition of the new chip design will provide a free template for anyone starting an electronics project using Circuits. This afternoon, Samir Hanna, vice president of Autodesk consumer products joined Brian and Rest Devices co-founder Dulcie Madden to discuss how the 123D family helped Rest Devices design their innovative baby bottle warmer.

IMG_20140107_132148_111_cropped high quality

Check out the video to see the design process:


Autodesk completed the acquisition of technology and the development team of, a web-based app and connected community for designing and simulating electronic circuits. This acquisition will enable Autodesk to bolster its offering of technology for electronic circuit design and simulation. Autodesk introduced 123D Circuits in September 2013. It expanded on the existing app by adding a breadboard view that allows users to build and experiment with circuits just like in real life and also lets users run code and simulate circuits in the app. The 123D Circuits community has already grown to more than 30,000 users.

To watch the entire fireside chat, visit